HSS-B20-NP-02
detaildesc

HSS-B20-NP-02

CUI Devices

Produkt-Nr.:

HSS-B20-NP-02

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

HEATSINK TO-220 3.6W ALUMINUM

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

Auf Lager : Bitte Anfrage

Bitte senden Sie RFQ, wir werden sofort antworten.

Certif02 Certif07 Certif03 Certif04 Certif08 Certif10 Certif09 Certif05 Certif06

Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Rectangular, Fins
Material Aluminum
Product Status Active
Fin Height 0.394" (10.00mm)
Series HSS
Type Board Level
Thermal Resistance @ Forced Air Flow 5.39°C/W @ 200 LFM
Length 0.748" (19.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 20.59°C/W
Material Finish Black Anodized
Package Bag
Attachment Method -
Width 0.830" (21.08mm)
Diameter -
Power Dissipation @ Temperature Rise 3.6W @ 75°C
Base Product Number HSS-B20
Package Cooled TO-220