HSS-B20-0635H
detaildesc

HSS-B20-0635H

CUI Devices

Produkt-Nr.:

HSS-B20-0635H

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

HEATSINK TO-220 2.6W ALUMINUM

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

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Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Rectangular, Fins
Material Aluminum
Product Status Active
Fin Height 0.748" (19.00mm)
Series HSS
Type Board Level, Vertical
Thermal Resistance @ Forced Air Flow 10.68°C/W @ 200 LFM
Length 0.520" (13.20mm)
Mfr CUI Devices
Thermal Resistance @ Natural 28.85°C/W
Material Finish Black Anodized
Package Bag
Attachment Method PC Pin
Width 0.250" (6.35mm)
Diameter -
Power Dissipation @ Temperature Rise 2.6W @ 75°C
Base Product Number HSS-B20
Package Cooled TO-220