HSS23-B20-NP
CUI Devices
Produit non:
HSS23-B20-NP
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEAT SINK, STAMPING, TO-218/TO-2
Quantité:
Livraison:
Paiement:
En stock : 2588
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$0.741
$0.741
10
$0.71345
$7.1345
25
$0.69312
$17.328
50
$0.65189
$32.5945
100
$0.585865
$58.5865
250
$0.5776
$144.4
500
$0.540493
$270.2465
1000
$0.532238
$532.238
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.787" (20.00mm) |
| Series | HSS |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 200 LFM |
| Length | 1.654" (42.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 10.19°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Bolt On |
| Width | 1.496" (38.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 7.36W @ 75°C |
| Package Cooled | TO-218, TO-220 |
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