HSS08-B18-CP
CUI Devices
Produit non:
HSS08-B18-CP
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEAT SINK, STAMPING, TO-218, 44.
Quantité:
Livraison:
Paiement:
En stock : 988
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$1.9475
$1.9475
10
$1.89905
$18.9905
25
$1.84794
$46.1985
50
$1.74534
$87.267
100
$1.642645
$164.2645
250
$1.539988
$384.997
500
$1.488669
$744.3345
1000
$1.334664
$1334.664
5000
$1.308996
$6544.98
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Square |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.492" (12.50mm) |
| Series | HSS |
| Type | Board Level, Vertical |
| Thermal Resistance @ Forced Air Flow | 3.50°C/W @ 200 LFM |
| Length | 1.750" (44.45mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 7.29°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | PC Pin |
| Width | 1.750" (44.45mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 10.3W @ 75°C |
| Package Cooled | TO-218 |
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