HSS20-B20-NP
CUI Devices
Produit non:
HSS20-B20-NP
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEAT SINK, STAMPING, TO-218/TO-2
Quantité:
Livraison:
Paiement:
En stock : 1940
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$0.6175
$0.6175
10
$0.59755
$5.9755
25
$0.58026
$14.5065
50
$0.54568
$27.284
100
$0.490485
$49.0485
250
$0.483588
$120.897
500
$0.452504
$226.252
1000
$0.445588
$445.588
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.433" (11.00mm) |
| Series | HSS |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 11.20°C/W @ 200 LFM |
| Length | 0.866" (22.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 26.40°C/W |
| Material Finish | Black Anodized |
| Package | Bag |
| Attachment Method | Bolt On |
| Width | 0.748" (19.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 2.84W @ 75°C |
| Package Cooled | TO-218, TO-220 |
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