CUI Devices
Produit non:
HSS-C2540-SMT-TR
Fabricant:
Forfait:
-
Lot:
-
Description:
HEAT SINK TO-263 COPPER
Quantité:
Livraison:
Paiement:
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
150
$1.582196
$237.3294
300
$1.489154
$446.7462
450
$1.396082
$628.2369
1050
$1.303001
$1368.15105
7500
$1.25646
$9423.45
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Shape | Rectangular, Fins |
Material | Copper |
Product Status | Active |
Fin Height | 0.450" (11.43mm) |
Series | HSS |
Type | Board Level |
Thermal Resistance @ Forced Air Flow | 5.50°C/W @ 200 LFM |
Length | 0.763" (19.38mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 21.90°C/W |
Material Finish | Tin |
Package | Tape & Reel (TR) |
Attachment Method | - |
Width | 1.000" (25.40mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
Base Product Number | HSS-C2540 |
Package Cooled | TO-263 (D²Pak) |