
CUI Devices
Produit non:
HSE-B18508-035H-03
Fabricant:
Forfait:
-
Lot:
-
Description:
HEAT SINK, EXTRUSION, TO-218, 50
Quantité:
Livraison:

Paiement:
S'il vous plaît envoyez RFQ, nous vous répondrons immédiatement.

| Shape | Rectangular, Angled Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.984" (25.00mm) |
| Series | HSE |
| Type | Board Level, Vertical |
| Thermal Resistance @ Forced Air Flow | 3.44°C/W @ 200 LFM |
| Length | 2.000" (50.80mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 5.77°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Clip and PC Pin |
| Width | 1.638" (41.60mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 13.0W @ 75°C |
| Base Product Number | HSE-B18508 |
| Package Cooled | TO-218 |