
CUI Devices
Produit non:
HSE-B1711-032
Fabricant:
Forfait:
-
Lot:
-
Description:
HEAT SINK, EXTRUSION, TO-220, 25
Quantité:
Livraison:

Paiement:
S'il vous plaît envoyez RFQ, nous vous répondrons immédiatement.

| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.354" (9.00mm) |
| Series | HSE |
| Type | Board Level |
| Thermal Resistance @ Forced Air Flow | 6.84°C/W @ 200 LFM |
| Length | 0.984" (25.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 20.27°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Bolt On |
| Width | 0.625" (16.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 3.7W @ 75°C |
| Base Product Number | HSE-B1711 |
| Package Cooled | TO-220 |