HSB15-404010
CUI Devices
Produit non:
HSB15-404010
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEAT SINK, BGA, 40 X 40 X 10 MM
Quantité:
Livraison:
Paiement:
En stock : 1020
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$1.501
$1.501
10
$1.4288
$14.288
25
$1.39156
$34.789
50
$1.35413
$67.7065
100
$1.278795
$127.8795
250
$1.203612
$300.903
500
$1.128372
$564.186
1000
$1.053151
$1053.151
5000
$1.015531
$5077.655
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 3.90°C/W @ 200 LFM |
| Length | 1.575" (40.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 11.84°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Adhesive |
| Width | 1.575" (40.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 6.3W @ 75°C |
| Package Cooled | BGA |
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