HSB01-080808
CUI Devices
Produit non:
HSB01-080808
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Quantité:
Livraison:
Paiement:
En stock : 1190
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$0.6935
$0.6935
10
$0.66405
$6.6405
25
$0.6308
$15.77
50
$0.61427
$30.7135
100
$0.60591
$60.591
250
$0.564376
$141.094
500
$0.531183
$265.5915
1000
$0.481384
$481.384
5000
$0.464778
$2323.89
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.315" (8.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
| Length | 0.335" (8.50mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 39.10°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Adhesive (Not Included) |
| Width | 0.335" (8.50mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Package Cooled | BGA |
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