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HSE02-173213P
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HSE02-173213P

CUI Devices

Producto No:

HSE02-173213P

Fabricante:

CUI Devices

Paquete:

-

Lote:

-

Ficha de datos:

pdf

Descripción:

HEAT SINK, EXTRUSION, 17 X 31.9

Cantidad:

Entrega:

1.webp 4.webp 5.webp 2.webp 3.webp

Pago:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

En stock : Por favor investigación

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Información del producto

Parámetro Info

Guía del usuario

Shape Square, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.492" (12.50mm)
Series HSE
Type Top Mount
Thermal Resistance @ Forced Air Flow 6.70°C/W @ 200 LFM
Length 0.669" (17.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 21.44°C/W
Material Finish Blue Anodized
Package Box
Attachment Method Thermal Tape, Adhesive (Included)
Width 0.669" (17.00mm)
Diameter -
Power Dissipation @ Temperature Rise 3.5W @ 75°C
Package Cooled -