HSB16-404018
CUI Devices
Producto No:
HSB16-404018
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
HEAT SINK, BGA, 40 X 40 X 18 MM
Cantidad:
Entrega:
Pago:
En stock : 978
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$2.1185
$2.1185
10
$2.06245
$20.6245
25
$2.00678
$50.1695
50
$1.89544
$94.772
100
$1.78391
$178.391
250
$1.672418
$418.1045
500
$1.616653
$808.3265
1000
$1.449424
$1449.424
5000
$1.421552
$7107.76
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Información del producto
Parámetro Info
Guía del usuario
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.709" (18.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |
| Length | 1.575" (40.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 7.96°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Adhesive |
| Width | 1.575" (40.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 9.4W @ 75°C |
| Package Cooled | BGA |
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