HSS13-B20-NP
CUI Devices
Producto No:
HSS13-B20-NP
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
HEAT SINK, STAMPING, TO-220, 31
Cantidad:
Entrega:
Pago:
En stock : 1285
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$1.064
$1.064
10
$1.00605
$10.0605
25
$0.98002
$24.5005
50
$0.95342
$47.671
100
$0.90041
$90.041
250
$0.847438
$211.8595
500
$0.794466
$397.233
1000
$0.741504
$741.504
5000
$0.715018
$3575.09
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Información del producto
Parámetro Info
Guía del usuario
| Shape | Rectangular |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.508" (12.90mm) |
| Series | HSS |
| Type | Board Level, Vertical |
| Thermal Resistance @ Forced Air Flow | 7.70°C/W @ 200 LFM |
| Length | 1.220" (31.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 15.50°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | - |
| Width | 0.994" (25.25mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 4.8W @ 75°C |
| Package Cooled | TO-220 |
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