HSS25-B20-P51
CUI Devices
Producto No:
HSS25-B20-P51
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
HEAT SINK, STAMPING, TO-218/TO-2
Cantidad:
Entrega:
Pago:
En stock : Por favor investigación
Por favor envíe RFQ, responderemos inmediatamente.
Información del producto
Parámetro Info
Guía del usuario
| Shape | Square, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 1.673" (42.50mm) |
| Series | HSS |
| Type | Board Level |
| Thermal Resistance @ Forced Air Flow | 6.30°C/W @ 200 LFM |
| Length | 1.000" (25.40mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 12.75°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | PC Pin |
| Width | 1.000" (25.40mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 5.88W @ 75°C |
| Package Cooled | TO-218, TO-220 |
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