
CUI Devices
Producto No:
HSS23-B20-NP
Fabricante:
Paquete:
-
Lote:
-
Descripción:
HEAT SINK, STAMPING, TO-218/TO-2
Cantidad:
Entrega:

Pago:
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$0.741
$0.741
10
$0.71345
$7.1345
25
$0.69312
$17.328
50
$0.65189
$32.5945
100
$0.585865
$58.5865
250
$0.5776
$144.4
500
$0.540493
$270.2465
1000
$0.532238
$532.238
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| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.787" (20.00mm) |
| Series | HSS |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 200 LFM |
| Length | 1.654" (42.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 10.19°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Bolt On |
| Width | 1.496" (38.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 7.36W @ 75°C |
| Package Cooled | TO-218, TO-220 |