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HSE-B1711-032
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HSE-B1711-032

CUI Devices

Producto No:

HSE-B1711-032

Fabricante:

CUI Devices

Paquete:

-

Lote:

-

Ficha de datos:

pdf

Descripción:

HEAT SINK, EXTRUSION, TO-220, 25

Cantidad:

Entrega:

1.webp 4.webp 5.webp 2.webp 3.webp

Pago:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

En stock : Por favor investigación

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Información del producto

Parámetro Info

Guía del usuario

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.354" (9.00mm)
Series HSE
Type Board Level
Thermal Resistance @ Forced Air Flow 6.84°C/W @ 200 LFM
Length 0.984" (25.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 20.27°C/W
Material Finish Black Anodized
Package Box
Attachment Method Bolt On
Width 0.625" (16.00mm)
Diameter -
Power Dissipation @ Temperature Rise 3.7W @ 75°C
Base Product Number HSE-B1711
Package Cooled TO-220