HSB22-606010
CUI Devices
Producto No:
HSB22-606010
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
HEAT SINK, BGA, 60 X 60 X 10 MM
Cantidad:
Entrega:
Pago:
En stock : Por favor investigación
Por favor envíe RFQ, responderemos inmediatamente.
Información del producto
Parámetro Info
Guía del usuario
| Shape | Square, Pin Fins |
| Material | Aluminum |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |
| Length | 2.362" (60.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 7.62°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Adhesive |
| Width | 2.362" (60.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 9.8W @ 75°C |
| Package Cooled | BGA |
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