DIP624-011BLF
detaildesc

DIP624-011BLF

Amphenol ICC (FCI)

Produit non:

DIP624-011BLF

Forfait:

-

Lot:

-

Fiche technique:

pdf

Description:

CONN IC DIP SOCKET 24POS GOLD

Quantité:

Livraison:

1.webp 4.webp 5.webp 2.webp 3.webp

Paiement:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

En stock : S'il vous plaît enquête

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Information sur le produit

Paramètre Info

Guide de l'utilisateur

Contact Finish - Mating Gold
Operating Temperature -
Contact Material - Post Brass
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Termination Solder
Material Flammability Rating UL94 V-0
Mounting Type Through Hole
Product Status Obsolete
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Finish Thickness - Post 200.0µin (5.08µm)
Pitch - Post 0.100" (2.54mm)
Series -
Type DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Post Tin
Mfr Amphenol ICC (FCI)
Pitch - Mating 0.100" (2.54mm)
Features Open Frame
Termination Post Length 0.125" (3.18mm)
Contact Material - Mating Beryllium Copper
Package Bag
Contact Resistance -
Base Product Number DIP624