DILB20P-223TLF

Amphenol ICC (FCI)

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DILB20P-223TLF

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CONN IC DIP SOCKET 20POS TIN

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En stock : 13188

Minimum: 1 Multiples: 1

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Contact Finish - Mating	Tin
Operating Temperature	-55°C ~ 105°C
Contact Material - Post	Copper Alloy
Housing Material	Polyamide (PA), Nylon
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	20 (2 x 10)
Contact Finish Thickness - Post	100.0µin (2.54µm)
Pitch - Post	0.100" (2.54mm)
Series	-
Type	DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Amphenol ICC (FCI)
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Termination Post Length	0.124" (3.15mm)
Contact Material - Mating	Copper Alloy
Package	Tube
Contact Resistance	30mOhm
Base Product Number	DILB20P