XR2T-2021-N
Omron Electronics Inc-EMC Div
Produkt-Nr.:
XR2T-2021-N
Hersteller:
Paket:
-
Charge:
-
Datenblatt:
Beschreibung:
CONN IC DIP SOCKET 20POS GOLD
Menge:
Lieferung:
Zahlung:
Auf Lager : Bitte Anfrage
Bitte senden Sie RFQ, wir werden sofort antworten.
Produkt informationen
Parameter-Info
Benutzer handbuch
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 125°C |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | Flash |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Contact Finish Thickness - Post | Flash |
| Pitch - Post | 0.100" (2.54mm) |
| Series | XR2 |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Contact Finish - Post | Gold |
| Mfr | Omron Electronics Inc-EMC Div |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Open Frame, Seal Tape |
| Termination Post Length | 0.138" (3.50mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Bulk |
| Contact Resistance | 20mOhm |
| Base Product Number | XR2T |
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