Omron Electronics Inc-EMC Div
Produkt-Nr.:
XG8W-5034
Hersteller:
Paket:
-
Charge:
-
Beschreibung:
CONN HEADER R/A 50POS 2.54MM
Menge:
Lieferung:
Zahlung:
Minimum: 1 Vielfache: 1
Menge
Stückpreis
Ext-Preis
1
$5.0445
$5.0445
10
$4.58185
$45.8185
100
$4.037215
$403.7215
500
$3.431609
$1715.8045
1000
$2.926969
$2926.969
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Insulation Height | 0.236" (6.00mm) |
Ingress Protection | - |
Voltage Rating | 300V |
Current Rating (Amps) | 3A |
Contact Finish Thickness - Mating | 5.90µin (0.150µm) |
Contact Type | Male Pin |
Material Flammability Rating | UL94 V-0 |
Product Status | Active |
Contact Material | Brass, Nickel |
Connector Type | Header |
Mfr | Omron Electronics Inc-EMC Div |
Style | Board to Board or Cable |
Pitch - Mating | 0.100" (2.54mm) |
Features | - |
Contact Length - Mating | 0.236" (6.00mm) |
Contact Finish - Mating | Gold |
Operating Temperature | -55°C ~ 105°C |
Number of Rows | 2 |
Applications | - |
Number of Positions | 50 |
Termination | Solder |
Fastening Type | Push-Pull |
Mounting Type | Through Hole, Right Angle |
Contact Finish Thickness - Post | 5.90µin (0.150µm) |
Insulation Material | Polybutylene Terephthalate (PBT), Glass Filled |
Series | XG8 |
Contact Shape | Square |
Row Spacing - Mating | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Insulation Color | Black |
Contact Length - Post | 0.118" (3.00mm) |
Number of Positions Loaded | All |
Package | Bulk |
Shrouding | Unshrouded |
Mated Stacking Heights | - |
Overall Contact Length | - |
Base Product Number | XG8W |