TSM-115-03-S-DV

Samtec Inc.

Produkt-Nr.:

TSM-115-03-S-DV

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Beschreibung:

CONN HEADER SMD 30POS 2.54MM

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Auf Lager : 75

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Insulation Height	0.100" (2.54mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Type	Male Pin
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Header
Mfr	Samtec Inc.
Style	Board to Board or Cable
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Length - Mating	0.420" (10.67mm)
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	30
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Surface Mount
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	TSM
Contact Shape	Square
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	-
Number of Positions Loaded	All
Package	Tube
Shrouding	Unshrouded
Mated Stacking Heights	-
Overall Contact Length	-
Base Product Number	TSM-115