TS391SNL50
detaildesc

TS391SNL50

Chip Quik Inc.

Produkt-Nr.:

TS391SNL50

Hersteller:

Chip Quik Inc.

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

THERMALLY STABLE SOLDER PASTE NO

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form Jar, 1.76 oz (50g)
Process Lead Free
Wire Gauge -
Product Status Active
Flux Type No-Clean
Series -
Type Solder Paste
Mesh Type 4
Shelf Life Start Date of Manufacture
Shipping Info -
Mfr Chip Quik Inc.
Package Bulk
Shelf Life 12 Months
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Base Product Number TS391S