Zuhause / Wire to Board / TBL006V-500-11GY-2GY
TBL006V-500-11GY-2GY
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TBL006V-500-11GY-2GY

CUI Devices

Produkt-Nr.:

TBL006V-500-11GY-2GY

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

I/C Rectangular

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

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Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Wire Termination Screwless - Push Button Clamp
Operating Temperature -40°C ~ 105°C
Screw Thread -
Contact Material - Plating Copper Alloy - Tin Plated
Positions Per Level 11
Torque - Screw -
Screw Material - Plating -
Housing Material Polyamide (PA66), Nylon 6/6
Color Gray
Mounting Type Through Hole
Wire Gauge 16-20 AWG
Product Status Active
Number of Levels 1
Series TBL006V-500
Voltage 300 V
Mfr CUI Devices
Mating Orientation Vertical with Board
Pitch 0.197" (5.00mm)
Clamp Material - Plating -
Features -
Package Box
Current 10 A