SDL-130-G-11
Samtec Inc.
Produkt-Nr.:
SDL-130-G-11
Hersteller:
Paket:
-
Charge:
-
Datenblatt:
Beschreibung:
CONN RCPT 60POS 0.1 GOLD PCB
Menge:
Lieferung:
Zahlung:
Auf Lager : Bitte Anfrage
Bitte senden Sie RFQ, wir werden sofort antworten.
Produkt informationen
Parameter-Info
Benutzer handbuch
| Insulation Height | 0.132" (3.35mm) |
| Ingress Protection | - |
| Voltage Rating | - |
| Current Rating (Amps) | - |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Type | Female Socket |
| Material Flammability Rating | - |
| Product Status | Discontinued at Digi-Key |
| Contact Material | Beryllium Copper |
| Connector Type | Receptacle |
| Mfr | Samtec Inc. |
| Style | Board to Board |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | - |
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 125°C |
| Number of Rows | 2 |
| Applications | - |
| Number of Positions | 60 |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Mounting Type | Through Hole |
| Contact Finish Thickness - Post | - |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Series | SDL |
| Contact Shape | Circular |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Contact Finish - Post | - |
| Insulation Color | Black |
| Contact Length - Post | 0.108" (2.75mm) |
| Number of Positions Loaded | All |
| Package | Tube |
| Mated Stacking Heights | - |
| Base Product Number | SDL-130 |
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