MQ172-3PA(66)
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MQ172-3PA(66)

Hirose Electric Co Ltd

Produkt-Nr.:

MQ172-3PA(66)

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

CONN RCPT 3P 0.031 GOLD SMD R/A

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

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Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Insulation Height 0.154" (3.90mm)
Ingress Protection -
Voltage Rating 30VDC, 40VAC
Current Rating (Amps) 3A
Contact Finish Thickness - Mating 8.00µin (0.203µm)
Contact Type Center Strip Contact
Material Flammability Rating UL94 V-0
Product Status Obsolete
Contact Material Copper Alloy
Connector Type Receptacle
Mfr Hirose Electric Co Ltd
Style Board to Cable/Wire
Pitch - Mating 0.031" (0.80mm)
Features Board Guide, Solder Retention
Contact Finish - Mating Gold
Operating Temperature -30°C ~ 75°C
Number of Rows 1
Applications General Purpose, Telecommunications
Number of Positions 3
Termination Solder
Fastening Type Friction Lock
Mounting Type Surface Mount, Right Angle
Contact Finish Thickness - Post -
Insulation Material Polyamide (PA), Nylon
Series MQ172
Contact Shape -
Row Spacing - Mating -
Contact Finish - Post -
Insulation Color Black
Contact Length - Post -
Number of Positions Loaded All
Package Tape & Reel (TR)
Mated Stacking Heights -