HPF-10-01-T-S

Samtec Inc.

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HPF-10-01-T-S

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Beschreibung:

CONN RCPT 10POS 0.2 TIN PCB

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Insulation Height	0.351" (8.92mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	-
Contact Type	Female Socket
Material Flammability Rating	-
Product Status	Active
Contact Material	Beryllium Copper
Connector Type	Receptacle
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.200" (5.08mm)
Features	-
Contact Finish - Mating	Tin
Operating Temperature	-
Number of Rows	1
Applications	-
Number of Positions	10
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	HPF
Contact Shape	Square
Row Spacing - Mating	-
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	0.102" (2.60mm)
Number of Positions Loaded	All
Package	Tube
Mated Stacking Heights	-
Base Product Number	HPF-10