ESW-113-23-S-D

Samtec Inc.

Produkt-Nr.:

ESW-113-23-S-D

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Beschreibung:

CONN SOCKET 26POS 0.1 GOLD PCB

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Auf Lager : 85

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Insulation Height	0.535" (13.60mm)
Ingress Protection	-
Voltage Rating	550VAC
Current Rating (Amps)	5.2A per Contact
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	26
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	ESW
Contact Shape	Square
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	0.190" (4.83mm)
Number of Positions Loaded	All
Package	Tube
Mated Stacking Heights	-
Base Product Number	ESW-113