ESQT-130-03-G-Q-368

Samtec Inc.

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ESQT-130-03-G-Q-368

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CONN SOCKET 120P 0.079 GOLD PCB

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Insulation Height	0.368" (9.35mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	4.5A per Contact
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Style	Board to Board or Cable
Pitch - Mating	0.079" (2.00mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	4
Applications	-
Number of Positions	120
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	3.00µin (0.076µm)
Insulation Material	Liquid Crystal Polymer (LCP)
Series	ESQT
Contact Shape	Square
Row Spacing - Mating	0.079" (2.00mm)
Contact Finish - Post	Gold
Insulation Color	Black
Contact Length - Post	0.090" (2.29mm)
Number of Positions Loaded	All
Package	Tube
Mated Stacking Heights	-
Base Product Number	ESQT-130