DIP600T300P18
detaildesc

DIP600T300P18

Chip Quik Inc.

Produkt-Nr.:

DIP600T300P18

Hersteller:

Chip Quik Inc.

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

DIP-18 (0.6" BODY) TO DIP-18 (0.

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Series Proto-Advantage
Package Accepted -
Number of Positions 18
Mfr Chip Quik Inc.
Proto Board Type DIP to DIP
Pitch 0.100" (2.54mm)
Material FR4 Epoxy Glass
Package Bulk
Size / Dimension 0.900" L x 0.700" W (22.86mm x 17.78mm)
Product Status Active
Board Thickness 0.063" (1.60mm)
Base Product Number DIP600