CLP-111-02-L-D

Samtec Inc.

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CLP-111-02-L-D

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Beschreibung:

CONN RCPT 22POS 0.05 GOLD SMD

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Insulation Height	0.090" (2.29mm)
Ingress Protection	-
Voltage Rating	240VAC, 330VDC
Current Rating (Amps)	3.3A per Contact
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Type	Female Socket
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Receptacle
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.050" (1.27mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	22
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Surface Mount
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	CLP
Contact Shape	Square
Row Spacing - Mating	0.050" (1.27mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	-
Number of Positions Loaded	All
Package	Bulk
Mated Stacking Heights	-
Base Product Number	CLP-111