BSW-108-04-G-S

Samtec Inc.

Produkt-Nr.:

BSW-108-04-G-S

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Beschreibung:

CONN RCPT 8POS 0.1 GOLD PCB

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Auf Lager : 230

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Insulation Height	0.350" (8.89mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Type	Female Socket
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Receptacle, Breakaway
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	1
Applications	-
Number of Positions	8
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole, Bottom Mount
Contact Finish Thickness - Post	-
Insulation Material	Polyethylene Terephthalate (PET), Glass Filled
Series	BSW
Contact Shape	Square
Row Spacing - Mating	-
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	0.170" (4.32mm)
Number of Positions Loaded	All
Package	Bulk
Mated Stacking Heights	-
Base Product Number	BSW-108