LOTES
Produkt-Nr.:
ACA-SPI-004-K01
Hersteller:
Paket:
-
Charge:
-
Datenblatt:
-
Beschreibung:
SPI 8 PIN_IC 208mil
Menge:
Lieferung:
Zahlung:
Bitte senden Sie RFQ, wir werden sofort antworten.
Contact Finish - Mating | Gold |
Operating Temperature | - |
Contact Material - Post | Phosphor Bronze |
Housing Material | Liquid Crystal Polymer (LCP) |
Contact Finish Thickness - Mating | 1.00µin (0.025µm) |
Termination | Solder |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Surface Mount |
Product Status | Active |
Number of Positions or Pins (Grid) | 8 (2 x 4) |
Contact Finish Thickness - Post | 1.00µin (0.025µm) |
Pitch - Post | 0.050" (1.27mm) |
Series | - |
Type | SOIC |
Contact Finish - Post | Gold |
Mfr | LOTES |
Pitch - Mating | 0.050" (1.27mm) |
Features | Board Guide, Closed Frame |
Termination Post Length | - |
Contact Material - Mating | Phosphor Bronze |
Package | Tape & Reel (TR) |
Contact Resistance | 30mOhm |