10-8300-210C
Aries Electronics
Produkt-Nr.:
10-8300-210C
Hersteller:
Paket:
-
Charge:
-
Datenblatt:
Beschreibung:
CONN IC DIP SOCKET 10POS GOLD
Menge:
Lieferung:
Zahlung:
Auf Lager : Bitte Anfrage
Bitte senden Sie RFQ, wir werden sofort antworten.
Produkt informationen
Parameter-Info
Benutzer handbuch
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 105°C |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Current Rating (Amps) | 3 A |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 10 (2 x 5) |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 8 |
| Type | DIP, 0.2" (5.08mm) Row Spacing |
| Contact Finish - Post | Gold |
| Mfr | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame, Elevated |
| Termination Post Length | 0.140" (3.56mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Bulk |
| Contact Resistance | - |
| Base Product Number | 10-8300 |
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