0879200312

Molex

Produkt-Nr.:

0879200312

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Beschreibung:

CH 2.54MM PITCH DRSW SMT HEADER

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Insulation Height	0.090" (2.29mm)
Ingress Protection	-
Voltage Rating	250V
Current Rating (Amps)	3A
Contact Finish Thickness - Mating	98.4µin (2.50µm)
Contact Type	Male Pin
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Copper Alloy
Connector Type	Header
Mfr	Molex
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	Board Guide, Pick and Place
Contact Length - Mating	0.424" (10.77mm)
Contact Finish - Mating	Tin
Operating Temperature	-55°C ~ 105°C
Number of Rows	2
Applications	-
Number of Positions	14
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Surface Mount
Contact Finish Thickness - Post	98.4µin (2.50µm)
Insulation Material	Liquid Crystal Polymer (LCP), Glass Filled
Series	C-Grid 87920
Contact Shape	Square
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	-
Number of Positions Loaded	All
Package	Bulk
Shrouding	Unshrouded
Mated Stacking Heights	-
Overall Contact Length	-