BU280Z-178-HT
On Shore Technology Inc.
Produit non:
BU280Z-178-HT
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Forfait:
-
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-
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Description:
CONN IC DIP SOCKET 28POS GOLD
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En stock : S'il vous plaît enquête
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 125°C |
| Contact Material - Post | Brass |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Contact Finish Thickness - Post | Flash |
| Pitch - Post | 0.100" (2.54mm) |
| Series | BU-178HT |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Contact Finish - Post | Copper |
| Mfr | On Shore Technology Inc. |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Open Frame |
| Termination Post Length | 0.059" (1.50mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Tube |
| Contact Resistance | 7mOhm |
| Base Product Number | BU280Z |
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