BDN09-3CB/A01
CTS Thermal Management Products
Produit non:
BDN09-3CB/A01
Fabricant:
Forfait:
-
Lot:
-
Fiche technique:
Description:
HEATSINK CPU W/ADHESIVE .91"SQ
Quantité:
Livraison:
Paiement:
En stock : 2045
Minimum: 1 Multiples: 1
Qté
Prix unitaire
Prix Ext
1
$2.7075
$2.7075
10
$2.64005
$26.4005
25
$2.56918
$64.2295
50
$2.4263
$121.315
100
$2.28361
$228.361
250
$2.140844
$535.211
500
$2.069499
$1034.7495
1000
$1.855407
$1855.407
5000
$1.819725
$9098.625
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Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Shape | Square, Pin Fins |
| Material | Aluminum |
| Product Status | Active |
| Fin Height | 0.355" (9.02mm) |
| Series | BDN |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
| Length | 0.910" (23.11mm) |
| Mfr | CTS Thermal Management Products |
| Thermal Resistance @ Natural | 26.90°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Shelf Life | 24 Months |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Width | 0.910" (23.11mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | - |
| Base Product Number | BDN09 |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
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2000+Volume moyen quotidien RFQ
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15,000 ㎡En stock Entrepôt
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