BDN09-3CB
detaildesc

BDN09-3CB

CTS Thermal Management Products

Produit non:

BDN09-3CB

Forfait:

-

Lot:

-

Fiche technique:

-

Description:

HEATSINK CPU .91" SQ

Quantité:

Livraison:

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Paiement:

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En stock : 990

Minimum: 1 Multiples: 1

Qté

Prix unitaire

Prix Ext

  • 1

    $1.311

    $1.311

  • 10

    $1.2483

    $12.483

  • 25

    $1.21562

    $30.3905

  • 50

    $1.18275

    $59.1375

  • 100

    $1.11701

    $111.701

  • 250

    $1.051308

    $262.827

  • 500

    $0.985606

    $492.803

  • 1000

    $0.919904

    $919.904

  • 5000

    $0.887053

    $4435.265

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Information sur le produit

Paramètre Info

Guide de l'utilisateur

Shape Square, Pin Fins
Material Aluminum
Product Status Active
Fin Height 0.355" (9.02mm)
Series BDN
Type Top Mount
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM
Length 0.910" (23.11mm)
Mfr CTS Thermal Management Products
Thermal Resistance @ Natural 26.90°C/W
Material Finish Black Anodized
Package Box
Attachment Method Thermal Tape, Adhesive (Not Included)
Width 0.910" (23.11mm)
Diameter -
Power Dissipation @ Temperature Rise -
Base Product Number BDN09
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)