32-6554-10

Aries Electronics

Produit non:

32-6554-10

Fabricant:

Forfait:

Lot:

Fiche technique:

Description:

CONN IC DIP SOCKET ZIF 32POS TIN

Quantité:

Livraison:

Paiement:

En stock : 148

Minimum: 1 Multiples: 1

Qté

Prix unitaire

Prix Ext

Pas le prix que vous voulez? Envoyez RFQ maintenant et nous vous contacterons dès que possible.

Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	32 (2 x 16)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	55
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Closed Frame
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	32-6554