32-3553-11
Aries Electronics
Produit non:
32-3553-11
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-
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-
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Description:
CONN IC DIP SOCKET ZIF 32POS GLD
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Paiement:
En stock : S'il vous plaît enquête
S'il vous plaît envoyez RFQ, nous vous répondrons immédiatement.
Information sur le produit
Paramètre Info
Guide de l'utilisateur
| Contact Finish - Mating | Gold |
| Operating Temperature | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | - |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 32 (2 x 16) |
| Contact Finish Thickness - Post | - |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 55 |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Contact Finish - Post | Gold |
| Mfr | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame |
| Termination Post Length | 0.110" (2.78mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Bulk |
| Contact Resistance | - |
| Base Product Number | 32-3553 |
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