208-7391-55-1902

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208-7391-55-1902

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CONN SOCKET SOIC 8POS GOLD

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En stock : 41

Minimum: 1 Multiples: 1

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Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 150°C
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	8 (2 x 4)
Contact Finish Thickness - Post	30.0µin (0.76µm)
Pitch - Post	-
Series	Textool™
Type	SOIC
Contact Finish - Post	Gold
Mfr	3M
Pitch - Mating	-
Features	Closed Frame
Termination Post Length	0.140" (3.56mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	208