SDL-110-G-19

Samtec Inc.

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SDL-110-G-19

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Description:

CONN RCPT 20POS 0.1 GOLD PCB

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Insulation Height	0.083" (2.10mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Type	Female Socket
Material Flammability Rating	-
Product Status	Active
Contact Material	Beryllium Copper
Connector Type	Receptacle
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	20
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	SDL
Contact Shape	Circular
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	-
Insulation Color	Black
Contact Length - Post	0.082" (2.08mm)
Number of Positions Loaded	All
Package	Tube
Mated Stacking Heights	-
Base Product Number	SDL-110