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HSS21-B20-P53
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HSS21-B20-P53

CUI Devices

Product No:

HSS21-B20-P53

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.500" (12.70mm)
Series HSS
Type Board Level
Thermal Resistance @ Forced Air Flow 10.10°C/W @ 200 LFM
Length 1.000" (25.40mm)
Mfr CUI Devices
Thermal Resistance @ Natural 20.93°C/W
Material Finish Black Anodized
Package Box
Attachment Method PC Pin
Width 0.961" (24.40mm)
Diameter -
Power Dissipation @ Temperature Rise 3.58W @ 75°C
Package Cooled TO-218, TO-220