HSS05-C20-SMT-TR

CUI Devices

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HSS05-C20-SMT-TR

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HEAT SINK, STAMPING, TO-220, 12.

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Shape	Rectangular
Material	Copper Alloy
Product Status	Active
Fin Height	0.390" (9.91mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	14.00°C/W @ 200 LFM
Length	1.031" (26.20mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	32.69°C/W
Material Finish	Tin
Package	Tape & Reel (TR)
Attachment Method	-
Width	0.500" (12.70mm)
Diameter	-
Power Dissipation @ Temperature Rise	2.3W @ 75°C
Package Cooled	TO-220