CUI Devices
Product No:
HSS-C52-NP-SMT-TR
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK TO-252 COPPER
Quantity:
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Shape | Rectangular, Fins |
Material | Copper |
Product Status | Active |
Fin Height | 0.400" (10.16mm) |
Series | HSS |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 10.05°C/W @ 200 LFM |
Length | 0.315" (8.00mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 35.71°C/W |
Material Finish | Tin |
Package | Tape & Reel (TR) |
Attachment Method | - |
Width | 0.900" (22.86mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 2.1W @ 75°C |
Base Product Number | HSS-C52 |
Package Cooled | TO-252 (DPak) |