HSB22-606010
CUI Devices
Product No:
HSB22-606010
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 60 X 60 X 10 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum |
| Product Status | Active |
| Fin Height | 0.394" (10.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |
| Length | 2.362" (60.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 7.62°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Adhesive |
| Width | 2.362" (60.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 9.8W @ 75°C |
| Package Cooled | BGA |
HSB22-606010 Related Blog
Purchase must see! Electronic component selection from entry to give up
2024-10-24 38
Basic knowledge of crystal vibration, circuit design, non-vibration reasons, circuit principle, crystal frequency, digital circuit application (crystal vibration data download)
2024-04-08 96
Order transfer! A 30-year old Hong Kong-owned PCB factory in Shenzhen was sold
2024-02-22 43
New product release | Daoheshun infrared methane sensor, guarding the "last pass" of gas safety
2024-02-22 30
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
CopyRight © 道合顺 2013 - 2022 粤ICP备18104022号 粤公网安备 44030402004525号