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HSB15-404010
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HSB15-404010

CUI Devices

Product No:

HSB15-404010

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, BGA, 40 X 40 X 10 MM

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : 1020

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.501

    $1.501

  • 10

    $1.4288

    $14.288

  • 25

    $1.39156

    $34.789

  • 50

    $1.35413

    $67.7065

  • 100

    $1.278795

    $127.8795

  • 250

    $1.203612

    $300.903

  • 500

    $1.128372

    $564.186

  • 1000

    $1.053151

    $1053.151

  • 5000

    $1.015531

    $5077.655

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Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.394" (10.00mm)
Series HSB
Type Top Mount
Thermal Resistance @ Forced Air Flow 3.90°C/W @ 200 LFM
Length 1.575" (40.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 11.84°C/W
Material Finish Black Anodized
Package Box
Attachment Method Adhesive
Width 1.575" (40.00mm)
Diameter -
Power Dissipation @ Temperature Rise 6.3W @ 75°C
Package Cooled BGA