FI-DP58SB-VF88L-R700
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FI-DP58SB-VF88L-R700

JAE Electronics

Product No:

FI-DP58SB-VF88L-R700

Manufacturer:

JAE Electronics

Package:

-

Batch:

-

Datasheet:

pdf

Description:

CONN RCPT 58P 0.02 GOLD SMD R/A

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Insulation Height 0.346" (8.80mm)
Ingress Protection -
Voltage Rating -
Current Rating (Amps) 0.5A per Contact
Contact Finish Thickness - Mating 12.0µin (0.30µm)
Contact Type Center Strip Contact
Material Flammability Rating UL94 V-0
Product Status Obsolete
Contact Material Copper Alloy
Connector Type Receptacle
Mfr JAE Electronics
Style Board to Cable/Wire
Pitch - Mating 0.020" (0.50mm)
Features Board Guide, Solder Retention
Contact Finish - Mating Gold
Operating Temperature -40°C ~ 80°C
Number of Rows 1
Applications General Purpose
Number of Positions 58
Termination Solder
Fastening Type Latch Holder
Mounting Type Surface Mount, Right Angle
Contact Finish Thickness - Post 1.25µin (0.032µm)
Insulation Material Plastic
Series FI-DP
Contact Shape -
Row Spacing - Mating -
Contact Finish - Post Gold
Insulation Color Black
Contact Length - Post -
Number of Positions Loaded All
Package Tape & Reel (TR)
Mated Stacking Heights 8.8mm
Base Product Number FI-DP58