ESQT-113-03-L-D-327

Samtec Inc.

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ESQT-113-03-L-D-327

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Description:

CONN SOCKET 26POS 0.079 GOLD PCB

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Insulation Height	0.327" (8.30mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	4.5A per Contact
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Style	Board to Board or Cable
Pitch - Mating	0.079" (2.00mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	26
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	-
Insulation Material	Liquid Crystal Polymer (LCP)
Series	ESQT
Contact Shape	Square
Row Spacing - Mating	0.079" (2.00mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	0.131" (3.33mm)
Number of Positions Loaded	All
Package	Bulk
Mated Stacking Heights	-
Base Product Number	ESQT-113