BU400Z-178-HT

On Shore Technology Inc.

Product No:

BU400Z-178-HT

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CONN IC DIP SOCKET 40POS GOLD

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Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Contact Material - Post	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	78.7µin (2.00µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Product Status	Obsolete
Number of Positions or Pins (Grid)	40 (2 x 20)
Contact Finish Thickness - Post	Flash
Pitch - Post	0.100" (2.54mm)
Series	BU-178HT
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Copper
Mfr	On Shore Technology Inc.
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Termination Post Length	0.059" (1.50mm)
Contact Material - Mating	Beryllium Copper
Package	Tube
Contact Resistance	7mOhm
Base Product Number	BU400Z